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【英文标准名称】:Semiconductordevices.Mechanicalandclimatictestmethods.Solderability
【原文标准名称】:半导体装置.机械和气候耐受性试验方法.可焊性
【标准号】:BSEN60749-21-2011
【标准状态】:现行
【国别】:英国
【发布日期】:2011-08-31
【实施或试行日期】:2011-08-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Changesoftemperature;Climate;Climatictests;Components;Cyclicloading;Dimensions;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environment;Environmentaltesting;Environmentaltests;Impurities;Integratedcircuits;Mechanicaltesting;Resistance;Semiconductordevices;Semiconductors;Simulation;SMD;Solderability;Solderings;Surfacemounting;Temperature;Testing;Visualinspection(testing)
【摘要】:ThispartofIEC60749establishesastandardprocedurefordeterminingthesolderabilityofdevicepackageterminationsthatareintendedtobejoinedtoanothersurfaceusingtin-lead(SnPb)orlead-free(Pb-free)solderfortheattachment.Thistestmethodprovidesaprocedurefor‘dipandlook’solderabilitytestingofthroughhole,axialandsurfacemountdevices(SMDs)aswellasanoptionalprocedureforaboardmountingsolderabilitytestforSMDsforthepurposeofallowingsimulationofthesolderingprocesstobeusedinthedeviceapplication.Thetestmethodalsoprovidesoptionalconditionsforageing.Thistestisconsidereddestructiveunlessotherwisedetailedintherelevantspecification.NOTE1ThistestmethodisingeneralaccordwithIEC60068,butduetospecificrequirementsofsemiconductors,thefollowingtextisapplied.NOTE2Thistestmethoddoesnotassesstheeffectofthermalstresseswhichmayoccurduringthesolderingprocess.ReferenceshouldbemadeIEC60749-15orIEC60749-20.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:26P.;A4
【正文语种】:英语